BGA Rework Station

Model NO.
bga160
Welding Turning Rolls Type
Adjustable
Condition
New
Power Supply
220V, 50Hz
Dimension
400 * 550 * 430mm
Net Weight
15kg
Min Mounting BGA Size
3.5× 3.5mm
Power
200W
Max Mounting BGA Siz
≤ 20mm X20mm
Transport Package
Wooden Case
Specification
400 * 550 * 430mm
Trademark
Torch
Origin
Beijing, China
HS Code
8514200009
Production Capacity
300 Sets/Year
Reference Price
$ 2,159.10 - 2,339.10
Contact Us

Product Description

Desoldering worktable BGA 9 00-IR   


BGA Rework Station

Introduction:
     The desoldering worktable BGA900-IR is manufactured by our company which is heating by infrared ray in double-sided, can heat from the top and preheat at the bottom. Suit to welding, removal or repair BGA, PBGA, CSP and variety of packages, can meet the multi-layer PCB substrate and unleaded welding requirements. Configuration can be completed on the planting table BGA to plant the ball. The device repair wilding's mainly target is motherboards and graphics chip BGA of PC, desktops, switches, XBOX (including graphics chip, video card etc).

Features of BGA900:
  1. Double infrared ray heating systems, can heating at the top of the components and the bottom of PCB at the same time, compared with the Cyclones, the heating process is more stable and avoid uneven heating of the PCB which can cause warp; the use of adva nced infrared heating methods needn't replace the heating nozzle, this also save the cost of investment.
  2. Advanced temperature system: Independent heating from top to bottom and also independent temperature control, welding finished with the alarm function, all  this characteristics can be more convenient and comfortable.
  3. Fashionable appearance: black full design, arc top heater, small size, and could be placed  in a 400MM room.
  4. Chip oriention : Red  laser BGA chips center orientation  is easy to operate.
  5. Large area heating and preheating system: Top heating 80×80MM,bottom heating 200×200MM. It could be easy to deal with heavy thermal capacity PCB and other lead-free soldering.
  6. Integrative design: All-purpose orientation  bracket and PING could achieve sustainment and fixation of big size PCB. So, it is easy to prevent and rectify some transformable mainboard, to fix up  the PCB board and ensure the success of maintainment.
  7. Economical investment: Fully considered the reality of common maintain department, not only cut off the cost, but also ensure the quality.
  8. More users: small cubage, large warm-up area, very suit to computer mainboard, notebook PC, and individual maintain department. It  is convenient to transport and convey.
S pecification:
Specification
Heat infrared heating from top and bottom
Dimension L400mm * W350mm * H410mm
Weight About 15kg
Bracket It is decided by customers' request.
Packing It is decided by customers' request.
Packed weight  About 17kg
Electric parameters
Input power AC 220V 50Hz
Top heat IR heating 
Top heating size 80mm* 80mm
Top heating power 300W
Bottom heating IR heating
Bottom heating size 200mm* 200mm
Bottom heating power 600W
Total power 900W
Temperature controlling
top heating controlling Temperature controlling independently, high precision close loop controlling, error of the panel is 0.5%
top temperature measurement High sensitive K temperature sensor, monitoring temperature directly
Bottom heating controlling Temperature controlling independently, high precision close loop controlling, error of the panel is 0.5%, with alarm.
Bottom temperature measurement High sensitive K temperature sensor, monitoring temperature directly
Repairing function
Application For soldering, unsoldering, repairing BGA QFP CSP and semi conductors. 
 
BGA Rework Station BGA Rework Station BGA Rework Station

 

Welding Auxiliary Equipment & Apparatus

LEGALIS.IT, 2023